Efinix's FPGA devices feature innovative Quantum computing architecture and enhanced computing power

     The titanium FPGA of Efinix is manufactured in a 16 nm process to provide high performance and the lowest possible power consumption in a small physical size. With the density of various logic elements (LE) from 35000 to 1 million, and the compatibility with the RISC-V SoC (System on Chip) core of Efinix, it helps to transform the microchip into an accelerated embedded computing system. The Quantum computing structure in the titanium TI60 FPGA is composed of configurable blocks, switchable logic, and routing (XLR) units. The routing (XLR) unit can optimize the routing efficiency and speed, while achieving high utilization.

     The structure also has a highly configurable 10K embedded memory block and a dedicated high-speed DSP block. Together, these capabilities provide optimal performance for applications ranging from edge computing to industrial automation and video processing. The 16 nm process node provides the titanium FPGA with a small substrate and low power consumption, making it an ideal choice for highly integrated applications.

 
     The powerful I/O of these titanium alloy devices allows users to interface with processors or camera sensors through MIPI CSI-2/DSI or traditional LVDS. The high-performance architecture supports the processing power of personalized RTL algorithm or soft RISC-V processor, which is a more traditional method. Combining the two methods of RISC-V acceleration or custom instructions can optimize performance, cost, and power consumption.

     The Ti60W64 is unique because it can hold 60000 logic elements even though it is only 3.5 mm x 3.5 mm. If the space is further limited, please use the F100 BGA device of the system architecture, which includes the same Ti60, as well as the configuration of flash memory and HyperRAM memory. This product is a truly highly configurable SoC.